Qualcomm has started providing wireless chipsets that combine 3G and 4G wireless technology.
The cunning plan is to help carriers transition to the next generation of wireless technology. While many carriers around the world plan to upgrade their networks to 4G using LTE, 4G signals will not be available everywhere and punters will need to roam on 3G networks.
Huawei Technologies, LG Electronics Novatel Wireless, Sierra Wireless, and ZTE have been named as testing the new chips, which will be in the shops in the second half of 2010.
Each chip allows wireless phones and other portable devices to switch between a 4G wireless network using LTE and HSPA Plus, a 3G wireless technology.
Meanwhile Qualcomm is providing a new set of mobile-device chips to manufacturers for testing that will add more multimedia features to new smartphones.
This chipset family supports high-definition video recording and playback, enhanced graphics, and an overall chip design that is optimised for the web.
Qualcomm expects phone makers to have devices that use the MSM7x30 family of chipsets commercially available by the end of 2010.
The chipsets will allow phones to operate on the most advanced 3G wireless networks, such as those running the latest generation of HSPA and EV-DO .
They have been adapted for use on Android, Brew, Symbian, and Windows Mobile operating systems. The company says that applications the chips could enable include a 12-megapixel camera, 720p video recording, and 3D gaming.
Meanwhile Qualcomm has been telling the world plus dog that its 1Ghz Snapdragon ARM chip will ship in an upcoming Lenovo smartbook.
AT&T will be flogging the ARM powered Lenovo smartbook and there is some talk that ARM is also into the small form-factor laptop market and could give Intel's Atom some serious competition.
The ARM Cortex-A8 core has 1GHz of processing power and is already being seen in a few smartphones.